Volume 8 Number 11 (Nov. 2013)
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JSW 2013 Vol.8(11): 2775-2783 ISSN: 1796-217X
doi: 10.4304/jsw.8.11.2775-2783

Research on Component Assembly Environment and Its Implementation Mechanism Based on Software Product Line

Jianli Dong1, Wen Dong2, Xin Chen3
1HuaiHai Institute of Technology, Lianyungang, 222005, P.R.China
228th Subsection of United Logistics, LanZhou Military Region of PLA, Xi’an, 710043, P.R.China
3Unit 68026 of PLA, Houwuquan-New Village, Lanzhou, 730058, P.R.China

Abstract—For solving the key technical challenge and problem in the heterogeneous components assembly and realizing the industrialization production of software products, and to use the producing system and mode of the modern manufacturing industry for reference, a new industrialized PL-ISEE (product line based integrated software engineering environment) model is firstly proposed. And then, through the requirement analysis of the current component assembly technology, a heterogeneous component assembly line suited to the new PL-ISEE and its framework and implementation mechanism are systemically studied and discussed. This component assembly line or assembly environment will become a real industrialized software product line differed from traditional software engineering environments and development methods. Its research and application will help to promote the formation and development of modern software industry.

Index Terms—Software component, Component assembly, Component based software engineering, Software product line, PL-ISEE (product line based integrated software engineering environment).


Cite: Jianli Dong, Wen Dong, Xin Chen, "Research on Component Assembly Environment and Its Implementation Mechanism Based on Software Product Line," Journal of Software vol. 8, no. 11, pp. 2775-2783, 2013.

General Information

ISSN: 1796-217X (Online)
Frequency:  Bimonthly (Since 2020)
Editor-in-Chief: Prof. Antanas Verikas
Executive Editor: Ms. Yoyo Y. Zhou
Abstracting/ Indexing: DBLP, EBSCO, Google Scholar, ProQuest, INSPEC(IET), ULRICH's Periodicals Directory, WorldCat, etc
E-mail: jsw@iap.org
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