Volume 11 Number 6 (Jun. 2016)
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JSW 2016 Vol.11(6): 598-605 ISSN: 1796-217X
doi: 10.17706/jsw.11.6.598-605

Review and Evaluation of Cohesion and Coupling Metrics at Package and Subsystem Level

Shouki A. Ebad1*, Moataz A. Ahmed2
1Faculty of Computing and IT, Northern Border University, Saudi Arabia.
2Info. & Computer Science Department, King Fahd University of Petroleum and Minerals, Saudi Arabia.


Abstract—Cohesion and coupling metrics at package and subsystem level play a crucial role in guiding software packaging (partitioning) and analyzing the maintainability and reusability of software. There has been a number of attempts to propose frameworks to assess the cohesion and coupling metrics at class level. A little work has been done at a higher level. In this paper, we survey the existing cohesion and coupling metrics at package and subsystem level and present an attribute-based framework to assess these metrics. The framework is meant to guide researchers interested in proposing new metrics at package level. The paper discusses a number of metrics against the framework.

Index Terms—Cohesion, coupling, package, software metrics.

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Cite: Shouki A. Ebad, Moataz A. Ahmed, "Review and Evaluation of Cohesion and Coupling Metrics at Package and Subsystem Level," Journal of Software vol. 11, no. 6, pp. 598-605, 2016.

General Information

ISSN: 1796-217X (Online)
Frequency: Monthly
Editor-in-Chief: Prof. Antanas Verikas
Executive Editor: Ms. Yoyo Y. Zhou
Abstracting/ Indexing: DBLP, EBSCO, ProQuest, INSPEC, ULRICH's Periodicals Directory, WorldCat, etc
E-mail: jsw@iap.org
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